印制电路词汇

  Alu ·  2009-09-11 10:24  ·  40884 次点击
1、印制电路:printedcircuit
2、印制线路:printedwiring
3、印制板:printedboard
4、印制板电路:printedcircuitboard(PCB)
5、印制线路板:printedwiringboard(PWB)
6、印制元件:printedcomponent
7、印制接点:printedcontact
8、印制板装配:printedboardassembly
9、板:board
10、单面印制板:single-sidedprintedboard(SSB)
11、双面印制板:double-sidedprintedboard(DSB)
12、多层印制板:mulitlayerprintedboard(MLB)
13、多层印制电路板:mulitlayerprintedcircuitboard
14、多层印制线路板:mulitlayerpritedwiringboard
15、刚性印制板:rigidprintedboard
16、刚性单面印制板:rigidsingle-sidedprintedborad
17、刚性双面印制板:rigiddouble-sidedprintedborad
18、刚性多层印制板:rigidmultilayerprintedboard
19、挠性多层印制板:flexiblemultilayerprintedboard
20、挠性印制板:flexibleprintedboard
21、挠性单面印制板:flexiblesingle-sidedprintedboard
22、挠性双面印制板:flexibledouble-sidedprintedboard
23、挠性印制电路:flexibleprintedcircuit(FPC)
24、挠性印制线路:flexibleprintedwiring
25、刚性印制板:flex-rigidprintedboard,rigid-flexprintedboard
26、刚性双面印制板:flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted
27、刚性多层印制板:flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard
28、齐平印制板:flushprintedboard
29、金属芯印制板:metalcoreprintedboard
30、金属基印制板:metalbaseprintedboard
31、多重布线印制板:mulit-wiringprintedboard
32、陶瓷印制板:ceramicsubstrateprintedboard
33、导电胶印制板:electroconductivepasteprintedboard
34、模塑电路板:moldedcircuitboard
35、模压印制板:stampedprintedwiringboard
36、顺序层压多层印制板:sequentially-laminatedmulitlayer
37、散线印制板:discretewiringboard
38、微线印制板:microwireboard
39、积层印制板:buile-upprintedboard
40、积层多层印制板:build-upmulitlayerprintedboard(BUM)
41、积层挠印制板:build-upflexibleprintedboard
42、表面层合电路板:surfacelaminarcircuit(SLC)43、埋入凸块连印制板:B2itprintedboard
44、多层膜基板:multi-layeredfilmsubstrate(MFS)
45、层间全内导通多层印制板:ALIVHmultilayerprintedboard
46、载芯片板:chiponboard(COB)
47、埋电阻板:buriedresistanceboard
48、母板:motherboard
49、子板:daughterboard
50、背板:backplane
51、裸板:bareboard
52、键盘板夹心板:copper-invar-copperboard
53、动态挠性板:dynamicflexboard
54、静态挠性板:staticflexboard
55、可断拼板:break-awayplanel
56、电缆:cable
57、挠性扁平电缆:flexibleflatcable(FFC)
58、薄膜开关:membraneswitch
59、混合电路:hybridcircuit
60、厚膜:thickfilm
61、厚膜电路:thickfilmcircuit
62、薄膜:thinfilm
63、薄膜混合电路:thinfilmhybridcircuit
64、互连:interconnection
65、导线:conductortraceline
66、齐平导线:flushconductor
67、传输线:transmissionline
68、跨交:crossover
69、板边插头:edge-boardcontact
70、增强板:stiffener
71、基底:substrate
72、基板面:realestate
73、导线面:conductorside
74、元件面:componentside
75、焊接面:solderside
76、印制:printing
77、网格:grid
78、图形:pattern
79、导电图形:conductivepattern
80、非导电图形:non-conductivepattern
81、字符:legend
82、标志:mark
二、基材:
1、基材:basematerial
2、层压板:laminate
3、覆金属箔基材:metal-cladbadematerial
4、覆铜箔层压板:copper-cladlaminate(CCL)
5、单面覆铜箔层压板:single-sidedcopper-cladlaminate
6、双面覆铜箔层压板:double-sidedcopper-cladlaminate
7、复合层压板:compositelaminate
8、薄层压板:thinlaminate
9、金属芯覆铜箔层压板:metalcorecopper-cladlaminate
10、金属基覆铜层压板:metalbasecopper-cladlaminate
11、挠性覆铜箔绝缘薄膜:flexiblecopper-claddielectricfilm
12、基体材料:basismaterial
13、预浸材料:prepreg
14、粘结片:bondingsheet
15、预浸粘结片:preimpregnatedbondingsheer
16、环氧玻璃基板:epoxyglasssubstrate
17、加成法用层压板:laminateforadditiveprocess
18、预制内层覆箔板:masslaminationpanel
19、内层芯板:corematerial
20、催化板材:catalyzedboard,coatedcatalyzedlaminate
21、涂胶催化层压板:adhesive-coatedcatalyzedlaminate
22、涂胶无催层压板:adhesive-coateduncatalyzedlaminate
23、粘结层:bondinglayer
24、粘结膜:filmadhesive
25、涂胶粘剂绝缘薄膜:adhesivecoateddielectricfilm
26、无支撑胶粘剂膜:unsupportedadhesivefilm
27、覆盖层:coverlayer(coverlay)
28、增强板材:stiffenermaterial
29、铜箔面:copper-cladsurface
30、去铜箔面:foilremovalsurface
31、层压板面:uncladlaminatesurface
32、基膜面:basefilmsurface
33、胶粘剂面:adhesivefaec
34、原始光洁面:platefinish
35、粗面:mattfinish
36、纵向:lengthwisedirection
37、模向:crosswisedirection
38、剪切板:cuttosizepanel
39、酚醛纸质覆铜箔板:phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)
40、环氧纸质覆铜箔板:epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)
41、环氧玻璃布基覆铜箔板:epoxidewovenglassfabriccopper-cladlaminates
42、环氧玻璃布纸复合覆铜箔板:epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates
43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates
44、聚酯玻璃布覆铜箔板:ployesterwovenglassfabriccopper-cladlaminates
45、聚酰亚胺玻璃布覆铜箔板:polyimidewovenglassfabriccopper-cladlaminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates
47、环氧合成纤维布覆铜箔板:epoxidesyntheticfiberfabriccopper-cladlaminates
48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiberglasscopper-cladlaminates
49、超薄型层压板:ultrathinlaminate
50、陶瓷基覆铜箔板:ceramicsbasecopper-cladlaminates
51、紫外线阻挡型覆铜箔板:UVblockingcopper-cladlaminates
三、基材的材料
1、A阶树脂:A-stageresin
2、B阶树脂:B-stageresin
3、C阶树脂:C-stageresin
4、环氧树脂:epoxyresin
5、酚醛树脂:phenolicresin
6、聚酯树脂:polyesterresin
7、聚酰亚胺树脂:polyimideresin
8、双马来酰亚胺三嗪树脂:bismaleimide-triazineresin
9、丙烯酸树脂:acrylicresin
10、三聚氰胺甲醛树脂:melamineformaldehyderesin
11、多官能环氧树脂:polyfunctionalepoxyresin
12、溴化环氧树脂:brominatedepoxyresin
13、环氧酚醛:epoxynovolac
14、氟树脂:fluroresin
15、硅树脂:siliconeresin
16、硅烷:silane
17、聚合物:polymer
18、无定形聚合物:amorphouspolymer
19、结晶现象:crystallinepolamer
20、双晶现象:dimorphism
21、共聚物:copolymer
22、合成树脂:synthetic
23、热固性树脂:thermosettingresin
24、热塑性树脂:thermoplasticresin
25、感光性树脂:photosensitiveresin
26、环氧当量:weightperepoxyequivalent(WPE)
27、环氧值:epoxyvalue
28、双氰胺:dicyandiamide
29、粘结剂:binder
30、胶粘剂:adesive
31、固化剂:curingagent
32、阻燃剂:flameretardant
33、遮光剂:opaquer
34、增塑剂:plasticizers
35、不饱和聚酯:unsatuiatedpolyester
36、聚酯薄膜:polyester
37、聚酰亚胺薄膜:polyimidefilm(PI)
38、聚四氟乙烯:polytetrafluoetylene(PTFE)
39、聚全氟乙烯丙烯薄膜:perfluorinatedethylene-propylenecopolymerfilm(FEP)
40、增强材料:reinforcingmaterial
41、玻璃纤维:glassfiber
42、E玻璃纤维:E-glassfibre
43、D玻璃纤维:D-glassfibre
44、S玻璃纤维:S-glassfibre
45、玻璃布:glassfabric
46、非织布:non-wovenfabric
47、玻璃纤维垫:glassmats
48、纱线:yarn
49、单丝:filament
50、绞股:strand
51、纬纱:weftyarn
52、经纱:warpyarn
53、但尼尔:denier
54、经向:warp-wise
55、纬向:weft-wise,filling-wise
56、织物经纬密度:threadcount
57、织物组织:weavestructure
58、平纹组织:plainstructure
59、坏布:greyfabric
60、稀松织物:wovenscrim
61、弓纬:bowofweave
62、断经:endmissing
63、缺纬:mis-picks
64、纬斜:bias
65、折痕:crease
66、云织:waviness
67、鱼眼:fisheye
68、毛圈长:featherlength
69、厚薄段:mark
70、裂缝:split
71、捻度:twistofyarn
72、浸润剂含量:sizecontent
73、浸润剂残留量:sizeresidue
74、处理剂含量:finishlevel
75、浸润剂:size
76、偶联剂:couplintagent
77、处理织物:finishedfabric
78、聚酰胺纤维:polyarmidefiber
79、聚酯纤维非织布:non-wovenpolyesterfabric
80、浸渍绝缘纵纸:impregnatinginsulationpaper
81、聚芳酰胺纤维纸:aromaticpolyamidepaper
82、断裂长:breakinglength
83、吸水高度:heightofcapillaryrise
84、湿强度保留率:wetstrengthretention
85、白度:whitenness
86、陶瓷:ceramics
87、导电箔:conductivefoil
88、铜箔:copperfoil
89、电解铜箔:electrodepositedcopperfoil(EDcopperfoil)
90、压延铜箔:rolledcopperfoil
91、退火铜箔:annealedcopperfoil
92、压延退火铜箔:rolledannealedcopperfoil(RAcopperfoil)
93、薄铜箔:thincopperfoil
94、涂胶铜箔:adhesivecoatedfoil
95、涂胶脂铜箔:resincoatedcopperfoil(RCC)
96、复合金属箔:compositemetallicmaterial
97、载体箔:carrierfoil
98、殷瓦:invar
99、箔(剖面)轮廓:foilprofile
100、光面:shinyside
101、粗糙面:matteside
102、处理面:treatedside
103、防锈处理:stainproofing
104、双面处理铜箔:doubletreatedfoil
四、设计
1、原理图:shematicdiagram
2、逻辑图:logicdiagram
3、印制线路布设:printedwirelayout
4、布设总图:masterdrawing
5、可制造性设计:design-for-manufacturability
6、计算机辅助设计:computer-aideddesign.(CAD)
7、计算机辅助制造:computer-aidedmanufacturing.(CAM)
8、计算机集成制造:computerintegratmanufacturing.(CIM)
9、计算机辅助工程:computer-aidedengineering.(CAE)
10、计算机辅助测试:computer-aidedtest.(CAT)
11、电子设计自动化:electricdesignautomation.(EDA)
12、工程设计自动化:engineeringdesignautomaton.(EDA2)
13、组装设计自动化:assemblyaidedarchitecturaldesign.(AAAD)
14、计算机辅助制图:computeraideddrawing
15、计算机控制显示:computercontrolleddisplay.(CCD)
16、布局:placement
17、布线:routing
18、布图设计:layout
19、重布:rerouting
20、模拟:simulation
21、逻辑模拟:logicsimulation
22、电路模拟:circitsimulation
23、时序模拟:timingsimulation
24、模块化:modularization
25、布线完成率:layouteffeciency
26、机器描述格式:machinedescriptionmformat.(MDF)
27、机器描述格式数据库:MDFdatabse
28、设计数据库:designdatabase
29、设计原点:designorigin
30、优化(设计):optimization(design)
31、供设计优化坐标轴:predominantaxis
32、表格原点:tableorigin
33、镜像:mirroring
34、驱动文件:drivefile
35、中间文件:intermediatefile
36、制造文件:manufacturingdocumentation
37、队列支撑数据库:queuesupportdatabase
38、元件安置:componentpositioning
39、图形显示:graphicsdispaly
40、比例因子:scalingfactor
41、扫描填充:scanfilling
42、矩形填充:rectanglefilling
43、填充域:regionfilling
44、实体设计:physicaldesign
45、逻辑设计:logicdesign
46、逻辑电路:logiccircuit
47、层次设计:hierarchicaldesign
48、自顶向下设计:top-downdesign
49、自底向上设计:bottom-updesign
50、线网:net
51、数字化:digitzing
52、设计规则检查:designrulechecking
53、走(布)线器:router(CAD)
54、网络表:netlist
55、计算机辅助电路分析:computer-aidedcircuitanalysis
56、子线网:subnet
57、目标函数:objectivefunction
58、设计后处理:postdesignprocessing(PDP)
59、交互式制图设计:interactivedrawingdesign
60、费用矩阵:costmetrix
61、工程图:engineeringdrawing
62、方块框图:blockdiagram
63、迷宫:moze
64、元件密度:componentdensity
65、巡回售货员问题:travelingsalesmanproblem
66、自由度:degreesfreedom
67、入度:outgoingdegree
68、出度:incomingdegree
69、曼哈顿距离:manhattondistance
70、欧几里德距离:euclideandistance
71、网络:network
72、阵列:array
73、段:segment
74、逻辑:logic
75、逻辑设计自动化:logicdesignautomation
76、分线:separatedtime
77、分层:separatedlayer
78、定顺序:definitesequence
五、形状与尺寸:
1、导线(通道):conduction(track)
2、导线(体)宽度:conductorwidth
3、导线距离:conductorspacing
4、导线层:conductorlayer
5、导线宽度/间距:conductorline/space
6、第一导线层:conductorlayerNo.1
7、圆形盘:roundpad
8、方形盘:squarepad
9、菱形盘:diamondpad
10、长方形焊盘:oblongpad
11、子弹形盘:bulletpad
12、泪滴盘:teardroppad
13、雪人盘:snowmanpad
14、V形盘:V-shapedpad
15、环形盘:annularpad
16、非圆形盘:non-circularpad
17、隔离盘:isolationpad
18、非功能连接盘:monfunctionalpad
19、偏置连接盘:offsetland
20、腹(背)裸盘:back-bardland
21、盘址:anchoringspaur
22、连接盘图形:landpattern
23、连接盘网格阵列:landgridarray
24、孔环:annularring
25、元件孔:componenthole
26、安装孔:mountinghole
27、支撑孔:supportedhole
28、非支撑孔:unsupportedhole
29、导通孔:via
30、镀通孔:platedthroughhole(PTH)
31、余隙孔:accesshole
32、盲孔:blindvia(hole)
33、埋孔:buriedviahole
34、埋/盲孔:buried/blindvia
35、任意层内部导通孔:anylayerinnerviahole(ALIVH)
36、全部钻孔:alldrilledhole
37、定位孔:toalinghole
38、无连接盘孔:landlesshole
39、中间孔:interstitialhole
40、无连接盘导通孔:landlessviahole
41、引导孔:pilothole
42、端接全隙孔:terminalclearomeehole
43、准表面间镀覆孔:quasi-interfacingplated-throughhole
44、准尺寸孔:dimensionedhole
45、在连接盘中导通孔:via-in-pad
46、孔位:holelocation
47、孔密度:holedensity
48、孔图:holepattern
49、钻孔图:drilldrawing
50、装配图:assemblydrawing
51、印制板组装图:printedboardassemblydrawing
52、参考基准:datumreferan

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