**IPC技术标准目录**
IPC技术标准目录之电子组装（Assembly）
IPC-T-50FTermsandDefinitionforInterconnectingandPackagingElectronicCircuits
电子电路互连与封装的定义和术语
IPC-S-100StandardsandSpecificationsManual
标准和详细说明汇编手册
IPC-E-500IPCElectronicDocumentCollection
已出版的IPC标准电子文档资料合订本
IPC-TM-650TestMethodsManual
试验方法手册
IPC-ESD-20-20AssociationStandardfortheDevelopmentofanESDControlProgram
静电释放控制过程(由静电释放协会制定)
IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies
电气与电子组装件锡焊要求
IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1
J-STD-001辅助手册及指南及修改说明1
IPC-A-610CAcceptabilityofElectronicAssemblies
印制板组装件验收条件
IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparison
IPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-KElectronicAssemblyReferenceSet
电子组装成套手册，包括：IPC/EIAJ-STD-001C，IPC-HDBK-001，IPC-A-610C。
IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies
电缆和引线贴装的要求和验收
IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology
倒装芯片及芯片级封装技术的应用
IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation
芯片直装技术实施导则
IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications
倒装芯片用半导体设计标准
J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurations
FC（倒装片）和CSP(芯片级封装)的外形轮廓标准
IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps
倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003ChipMountingTechnology
芯片贴装技术
J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology
球栅阵列(BGA)及其它高密度封装技术的应用
IPC-7095DesignandAssemblyProcessImplementationforBGAs
球栅阵列的设计与组装过程的实施
IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBalls
BGA球形凸点的标准规范
IT-98000JPLChipScalePackagingGuidelines
JPL发布的CSP导则
注：IT(TheCaliforniaInstituteofTechnology)
JPL(TheJetPropulsionLaboratory)
IT-98080JPLBallGridArrayPackagingGuidelines
JPL发布的BGA封装导则
IT-98093ITRIChipCarrier,Phase1Report
ITRI关于芯片载体的报告
ITRI(TheInterconnectTechnologyResearchInstitute)
IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization
多芯片组件技术应用导则
IPC-M-108CleaningGuidesandHandbookManual
清洗导则和手册
IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs?
电路板离子洁净度测量：它告诉我们什么？
IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies
印制板及组装件清洗导则
IPC-SC-60APostSolderSolventCleaningHandbook
锡焊后溶剂清洗手册
IPC-SA-61PostSolderSemi-aqueousCleaningHandbook
锡焊后半水溶剂清洗手册
IPC-AC-62AAqueousPostSolderCleaningHandbook
锡焊后水溶液清洗手册
IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrinted
CircuitAssemblies
电化学迁移：印制电路组件的电气诱发故障
IPC-TR-580CleaningandCleanlinessTestProgramPhase1TestResults
清洗及清洁度试验计划1阶段试验结果
IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3–LowSolids,FluxesandPastesProcessedinAmbientAir
IPC第3阶段非清洗助焊剂研究
IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting
深入离子洁净度测试
IPC-9201SurfaceInsulationResistanceHandbook
表面绝缘电阻手册
IPC-TP-104KCleaning&CleanlinessTestProgram,Phase3WaterSolubleFluxes,
Part1&Part2第3阶段水溶性助焊剂清洗，第一和第二部分
IPC-M-109ComponentHandlingManual
元件处理手册
IPC/JEDECJ-STD-020BMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices
非密封固态表面贴装器件湿度／再流焊敏感度分类
IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices
对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
IPC/JEDECJ-STD-035AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponents
非气密封装电子元件用声波显微镜
IPC-9500-KSetoffourdocuments9501-9504
9501至9504手册合订本
IPC-DRM-18FComponentIdentificationDeskReferenceManual
零件分类标识手册
IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDeskReferenceManual
接插件焊接点评价手册
IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReferenceManual
接插件焊接点评价手册
IPC-DRM-56WirePreparation&CrimpingDeskReferenceManual
导线和端子预成形参考手册
IPC-DRM-53IntroductiontoElectronicsAssemblyDeskReferenceManual
电子组装基础介绍手册
IPC-M-103StandardsforSurfaceMountAssembliesManual
所有SMT标准合订本
IPC-M-104StandardsforPrintedBoardAssemblyManual
10种常用印制板组装标准合订本
IPC-TA-722TechnologyAssessmentofSoldering
锡焊技术精选手册
IPC-TA-723TechnologyAssessmentHandbookonSurfaceMounting
表面安装技术精选手册
IPC-TA-724TechnologyAssessmentSeriesonCleanRooms
清洁室技术精选系列
IPC-SM-780ComponentPackagingandInterconnectingwithEmphasisonSurfaceMounting
以表面安装为主的元件封装及互连导则
IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountAttachments
表面安装焊接件加速可靠性试验导则
IPC-PD-335ElectronicPackagingHandbook
电子封装手册
IPC-7525StencilDesignGuidelines
网版设计导则
IPC-TR-581IPCPhaseIIIControlledAtmosphereSolderingStudy
IPC第3阶段受控气氛焊接研究
IPC-MI-660IncomingInspectionofRawMaterialsManual
原材料接收检验手册
IPC/EIAJ-STD-004RequirementsforSolderingFluxes-IncludesAmendment1
锡焊焊剂要求（包括修改单1）
IPC/EIAJ-STD-005RequirementsforSolderingPastes-IncludesAmendment1
焊膏技术要求（包括修改单1）
IPC-HDBK-005GuidetoSolderPasteAssessment
焊膏性能评价手册
IPC/EIAJ-STD-006ARequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSolders电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求
IPC-SM-817GeneralRequirementsforDielectricSurfaceMountingAdhesives
表面安装用介电粘接剂通用要求
IPC-CA-821GeneralRequirementsforThermallyConductiveAdhesives
导热胶粘剂通用要求
IPC-3406GuidelinesforElectricallyConductiveSurfaceMountAdhesives
表面贴装导电胶使用指南
IPC-3408GeneralRequirementsforAnisotropicallyConductiveAdhesivesFilms
各向异性导电胶膜的一般要求
IPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies
印制板组装电气绝缘性能和质量手册
IPC-HDBK-830GuidelineforDesign,SelectionandApplicationofConformalCoatings
敷形涂层的设计，选择和应用手册
IPC-SM-840CQualificationandPerformanceofPermanentSolderMask-IncludesAmendment1
永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840GuidetoSolderPasteAssessment
焊膏性能评价手册
IPC-TP-1114TheLayman’sGuidetoQualifyingaProcesstoJ-STD-001
基于J-STD-001组装工艺雷氏选择法
IPC-TR-467SupportingData&NumericalExamplesforJ-STD-001(ControlofFluxes)
J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820Assembly&JoiningHandbook
装联手册
IPC-7530GuidelinesforTemperatureProfilingforMassSoldering(Reflow&Wave)Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments
表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090TheLayman’sGuidetoQualifyingNewFluxes
新型助焊剂雷氏选择法
IPC-TP-1115SelectionandImplementationStrategyforaLow-ResidueNo-CleanProcess
低残留不清洗工艺的选择和实施
IPC-S-816SMTProcessGuideline&Checklist
表面安装技术过程导则及检核表
IPC-TR-460ATrouble-ShootingChecklistforWaveSolderingPrintedWiringBoards
印制板波峰焊故障排除检查表
IPC-CM-770DComponentMountingGuidelinesforPrintedBoards
印制板元件安装导则
IPC-7912CalculationofDPMO&ManufacturingIndicesforPrintedBoardAssemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261In-ProcessDPMOandEstimatedYieldforPWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501PWBAssemblyProcessSimulationforEvaluationofElectronicComponents电子元件的印制板组装过程模拟评价
IPC-9502PWBAssemblySolderingProcessGuidelineforElectronicComponents
电子元件的印制板组装焊接过导则
IPC-9503MoistureSensitivityClassificationforNon-ICComponents
非集成电路元件的湿度敏感度分级
IPC-9504AssemblyProcessSimulationforEvaluationofNon-ICComponents(PreconditioningNon-ICComponents)
非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
IPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KIT
表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW,IPC-9850-TM-KTestMaterialsKitforSurfaceMountPlacementEquipmentStandardization
表面贴装设备性能测试用的标准工具包
•4IPC-9850PlacementAccuracyVerificationPanels
•1IPC-9850CMMMeasurementVerificationPanels
•150IPC-9850QFP-100GlassComponents
•130IPC-9850QFP-208GlassComponents
•150IPC-9850BGA-228GlassComponents
•NISTTraceableMeasurementCertificate
•CustomStorageCase
IPC-7711/217711&7721Package
合订本
IPC-7711ReworkofElectronicAssemblies
电子组装件的返工
IPC-7721RepairandModificationofPrintedBoardsandElectronicAssemblies
印制板和电子组装件的修复与修正
IPC/EIAJ-STD-002BSolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires
元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIAJ-STD-003SolderabilityTestsforPrintedBoards
印制板可焊性试验
IPC-TR-461Trouble-ShootingChecklistforWaveSolderingPrintedWiringBoards
印制板波峰焊故障排除检查表
IPC-TR-462SolderabilityEvaluationofPrintedBoardswithProtectiveCoatingsOverLong-termStorage
带保护性涂层印制板长期贮存的可焊性评价
IPC-TR-464AcceleratedAgingforSolderabilityEvaluations
可焊性加速老化评价(附修订)
IPC-TR-465-1RoundRobinTestonSteamAgerTemperatureControlStability
蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2TheEffectofSteamAgingTimeandTemperatureonSolderabilityTestResults
蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3EvaluationofSteamAgingonAlternativeFinishes,PhaseIIA
替代涂覆层的蒸汽老化评价
IPC-TR-466TechnicalReport:WettingBalanceStandardWeightComparisonTest
技术报告:润湿天平称重标准对比测试
SMC-WP-001SolderingCapabilityWhitePaperReport
可焊性工艺导论
SMC-WP-005PCBSurfaceFinishes
印制电路板表面清洗
一、设计（Design）部分
IPC-M-106TechnologyReferenceforDesignManual设计技术手册
IPC-2220DesignStandardSeries设计标准系列手册
IPC-2221AGenericStandardonPrintedBoardDesign印制板设计通用标准
IPC-2222SectionalStandardonRigidOrganicPrintedBoards刚性有机印制板设计分标准
IPC-2223SectionalDesignStandardforFlexiblePrintedBoards挠性印制板设计分标准
IPC-2224SectionalStandardofDesignofPWBforPCCardPC卡用印制电路板分设计分标准
IPC-2225SectionalDesignStandardforOrganicMultichipModules(MCM-L)andMCM-LAssemblies有机多芯片模块(MCM-L)及其组装件设计分标准
IPC-2226SectionalDesignStandardforHighDensityInterconnect(HDI)PrintedBoards高密度互连(HDI)印制板设计分标准
IPC-SM-782ASurfaceMountDesignandLandPatternStandard–IncludesAmendments1&2表面安装设计及连接盘图形标准(包括修订1和2)
IPC-EM-782SurfaceMountDesign&LandPatternStandardSpreadsheet表面安装设计及连接盘图形标准
IPC-D-859DesignStandardforThickFilmMultilayerHybridCircuits厚膜多层混合电路设计标准
IPC-1902IPC/IECGridSystemsforPrintedCircuitsIPC/IEC印制电路网格体系
SMC-WP-004DesignforSuccess成功的综合设计分析手册
IPC-PWB-EVAL-CHPrintedCircuitBoardDefectEvaluationChart印制板缺陷评估图册
IPC/JPCA-2315DesignGuideforHighDensityInterconnects&Microvias高密度互连(HDI)和微通孔设计指南
IPC-2615PrintedBoardDimensionsandTolerances印制板尺寸和公差
IPC-A-311ProcessControlsforPhototoolGenerationandUse照相版制作和使用的过程控制
IPC-D-279DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies高可靠表面安装印制板组装件技术设计导则
IPC-D-310CGuidelinesforPhototoolGenerationandMeasurementTechniques照相版制作指南和测量技术
IPC-D-322GuidelinesforSelectingPrintedWiringBoardSizesUsingStandardPanelSizes使用标准在制板尺寸的印制板尺寸选择指南
IPC-D-422DesignGuideforPressFitRigidPrintedBoardBackPlane压配合刚性印制背板设计指南
IPC-PWBADV-SG02(HARDCOPY)
IPC-PWBADV-CD(CD)PCBAdvancedDesignerCertificationStudyGuide印制电路板高级设计师证书学习指南和多媒体光盘
IPC-PWB-CRT-SG01(HARDCOPY)
IPC-PWB-CERTCD1(CD)PCBDesignerCertificationStudyGuide印制电路板设计师证书学习指南和多媒体光盘
IPC-2531StandardRecipeFileFormatSpecificationSMEMA发布：标准“菜单”（过程控制）文件格式规范注：SMEMA{TheSurfaceMountEquipmentManufacturersAssociationmergedwithIPC}
IPC-2541GenericRequirementsforElectronicsManufacturingShopFloorEquipmentCommunication电子制造车间现场设备信息沟通(CAMX)通用要求
IPC-2546SectionalRequirementsforSpecificPrintedCircuitBoardAssemblyEquipment特殊印制板组装设备分要求
IPC-2547SectionalRequirementsforShopFloorElectronicInspectionandTestEquipmentCommunication车间现场电子检验及测试设备信息沟通分要求
IPC-2571GenericRequirementsforElectronicsManufacturingSupplyChainCommunication-ProductDataeXchange(PDX)电子制造供应链信息沟通分要求产品数据交换
IPC-2576SectionalRequirementsforElectronicsManufacturingSupplyChainCommunicationofAs-BuiltProductData–ProductDataeXchange制成态产品-产品数据电子制造供应链信息沟通分要求
IPC-2578SectionalRequirementsforSupplyChainCommunicationofBillofMaterialandProductDesignConfigurationData-ProductDataeXchange材料单及产品设计构造数据-产品数据交换供应链信息沟通分要求
IPC-2511AGenericRequirementsforImplementationofProductManufacturingDescriptionData&TransferMethodology实施产品制造数据描述及其传输方法学的通用要求
IPC-2501DefinitionforWeb-BasedExchangeofXMLDataXML数据网络交换定义
IPC-2511BGenericRequirementsforImplementationofProductManufacturingDescriptionData&TransferXMLSchemaMethodology实施产品制造数据描述及其网络传输方法学的通用要求
IPC-2512ASectionalRequirementsforImplementationofandyistrativeMethodsforManufacturingDataDescription实施制造数据描述管理方法的分要求
IPC-2513ASectionalRequirementsforImplementationofDrawingMethodsforManufacturingDataDescription实施制造数据描述绘制方法的分要求
IPC-2514ASectionalRequirementsforImplementationofPrintedBoardManufacturingDataDescription实施印制板制造数据描述的分要求
IPC-2515ASectionalRequirementsforImplementationofBare-BoardProductTestingDataDescription实施裸板成品测试数据描述的分要求
IPC-2516ASectionalRequirementsforImplementationofAssembledBoardProductManufacturingDataDescription实施已组装板制造数据描述的分要求
IPC-2517ASectionalRequirementsforImplementationofAssemblyIn-CircuitTestDataDescription实施组装件在线测试数据描述的分要求
IPC-2518ASectionalRequirementsforImplementationofPartsListProductManufacturingDataDescription实施零部件制造数据描述的分要求
IPC-D-356BBareBoardElectricalTestDataFormat裸基板电检测的数据格式
二、印制电路板（PrintedCircuitBoards）
IPC-M-105RigidPrintedBoardManual刚性印制板设计手册
IPC-D-325ADocumentationRequirementsforPrintedBoards印制板设计文件图册要求
IPC-PE-740ATroubleshootingforPrintedBoardManufactureandAssembly印制板制造和组装的故障排除
IPC-6010SeriesIPC-6010QualificationandPerformanceSeriesIPC-6010印制电路板质量标准和性能规范系列手册
IPC-6011GenericPerformanceSpecificationforPrintedBoards印制板通用性能规范
IPC-6013-KQualification&PerformanceSpecificationforFlexiblePrintedBoards(IncludesAmendment1)挠性印制板的鉴定与性能规范（包括修改单1）
IPC-6016Qualification&PerformanceSpecificationforHighDensityInterconnect(HDI)LayersorBoards高密度互连(HDI)层或印制板的鉴定与性能规范
IPC-6012A-AMQualificationandPerformanceSpecificationforRigidPrintedBoards,IncludesAmendment1刚性印制板的鉴定与性能规范(包括修改单1)
IPC-6018AMicrowaveEndProductBoardInspectionandTech微波成品印制板的检验和测试
IPC-6015Qualification&PerformanceSpecificationforOrganicMultichipModule(MCM-L)MountingandInterconnections有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范
IPC-A-600FAcceptabilityofPrintedBoards印制板验收条件
IPC-QE-605APrintedBoardQualityEvaluationHandbook印制板质量评价
IPC-QE-605A-KITHardCopyandCD印制板质量评价书和光盘(CD)
IPC-HM-860SpecificationforMultilayerHybridCircuits多层混合电路规范
IPC-TF-870QualificationandPerformanceofPolymerThickFilmPrintedBoards聚合物厚膜印制板的鉴定与性能
IPC-ML-960QualificationandPerformanceSpecificationforMassLaminationPanelsforMultilayerprintedBoards多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范
IPC-TR-481ResultsofMultilayerTestsProgramRoundRobin多层印制板联合试验计划结果
IPC-TR-551QualityAssessmentofPrintedBoardsUsedforMountingandInterconnectingElectronicComponents用于电子元件安装与互连的印制板质量评价
IPC-TR-579RoundRobinReliabilityEvaluationofSmallDiameterPlatedThroughHolesinPCBs印制板中小直径镀覆孔可靠性评价联合试验
IPC-4552SpecificationforElectrolessNickel/ImmersionGold(ENIG)PlatingforPrintedCircuitBoards印制电路板表面非电镀镍/沉金规范
IPC-DR-572DrillingGuidelinesforPrintedBoards印制板钻孔导则
IT-95080Improvements/AlternativestoMechanicalDrillingofPCBVias印制板通孔机加工方案的改进和优选手册
IPC-NC-349ComputerNumericalControlFormattingforDrillersandRouters钻床和铣床用计算机数字控制格式
IPC-SM-839Pre&PostSolderMaskApplicationCleaningGuidelines施加阻焊前及施加后清洗导则
IPC-HDI-1HighDensityInterconnectMicroviaTechnologyCompendium高密度(HDI)互连微通孔技术纲要
IPC/JPCA-4104SpecificationforHighDensityInterconnect(HDI)andMicroviaMaterials高密度互连(HDI)及微导通孔材料规范
IPC-6016Qualification&PerformanceSpecificationforHighDensityInterconnect(HDI)LayersorBoards高密度互连(HDI)层或印制板的鉴定与性能规范
IPC/JPCA-6801IPC/JPCATerms&Definitions,TestMethods,andDesignExamplesforBuild-Up/HighDensityInterconnection积层/高密度互连的术语和定义、试验方法与设计例
IPC-DD-135QualificationTestingforDepositedOrganicInterlayerDielectricMaterialsforMultichipModules多芯片组件内层有机绝缘材料的鉴定试验
IT-96060HighDensityPCBMicroviaEvaluation(OctoberProject),PhaseI,Round1高密度印制板微通孔评价指标手册,第一期第一版
IT-97071HighDensityPCBMicroviaEvaluation,PhaseI,Round2高密度印制板微通孔评价指标手册,第一期第二版
IT-30101HighDensityPCBMicroviaEvaluation,PhaseI,Round3高密度印制板微通孔评价指标手册,第一期第三版
IT-98123MicroviaManufacturingTechnologyCostAnalysisReport微通孔制作技术成本核算报告
IPC-2141ControlledImpedanceCircuitBoards&HighSpeedLogicDesign控制阻抗电路板与高速逻辑设计
IPC-2252DesignGuideforRF/MicrowaveCircuitBoards射频/微波电路板设计指南
IPC-4103SpecificationforBaseMaterialsforHighSpeed/HighFrequencyApplications高速高频用基材规范
IPC-6018AMicrowaveEndProductBoardInspectionandTest微波成品印制板的检验和测试
IPC-D-317ADesignGuidelinesforElectronicPackagingUtilizingHighSpeedTechniques采用高速技术电子封装设计导则
IPC-M-102FlexibleCircuitsCompendium挠性电路纲要
IPC-4202FlexibleBaseDielectricsforUseinFlexiblePrintedCircuitry挠性印制线路用挠性绝缘基底材料
IPC-4203AdhesiveCoatedDielectricFilmsforUseasCoverSheetsforFlexiblePrintedCircuitryandFlexibleAdhesiveBondingFilms挠性印制线路覆盖层用涂粘接剂绝缘薄膜
IPC-4204FlexibleMetal-CladDielectricsforUseinFabricationofFlexiblePrintedCircuitry挠性金属箔去电应用于柔性电路组装
IPC-6013-KQualification&PerformanceSpecificationforFlexiblePrintedBoards&Amendment1挠性印制板的鉴定与性能规范（包括修改单1）
IPC/JPCA-6202IPC/JPCAPerformanceGuideManualforSingle-andDouble-SidedFlexiblePrintedWiringBoardsIPC/JPCA单双面挠性印制板性能手册
IPC-FA-251GuidelinesforAssemblyofSingle-andDouble-SidedFlexCircuits单面和双面挠性电路组装导则
IPC-FC-234CompositeMetallicMaterialsSpecificationforPrintedWiringBoards印制线路板复合金属材料规范
IPC-MB-380GuidelinesforMoldedInterconnectionDevices模压互连器件导则
IPC-M-107StandardsforPrintedBoardMaterialsManual印制板材料标准手册
IPC-MI-660IncomingInspectionofRawMaterialsManual原材料接收检验手册
IPC-4101ASpecificationsforBaseMaterialsforRigidandMultilayerPrintedBoards刚性及多层印制板用基材规范
IPC-4121GuidelinesforSelectingCoreConstructionforMultilayerPrintedWiringBoardApplications多层印制板用芯板结构选择导则
IPC-4562MetalFoilforPrintedWiringApplications印制线路用金属箔
IPC-CF-148AResinCoatedMetalforPrintedBoards印制板用涂树脂金属箔
IPC-CF-152BCompositeMetallicMaterialsSpecificationforPrintedWiringBoards印制线路板复合金属材料规范
IPC-TR-482NewDevelopmentsinThinCopperFoils薄铜箔的新发展
IPC-TR-484ResultsofIPCCopperFoilDuctilityRoundRobinStudyIPC铜箔延展性联合研究结果
IPC-TR-485ResultsofCopperFoilRuptureStrengthTestRoundRobinStudy铜箔断裂强度试验联合研究结果
IPC-4412SpecificationforFinishedFabricWovenfrom”E”GlassforPrintedBoards“E”类精纺玻璃纤维层印制板技术规范
IPC-4130Specification&CharacterizationMethodsforNonwoven“E”GlassMaterialsE玻璃纤维非织布材料规范及性能确定方法
IPC-4110SpecificationandCharacterizationMethodsforNonwovenCelluloseBasedPaperforPrintedBoards印制板用纤维纸规范及性能确定方法
IPC-4411-KSpecificationandCharacterizationMethodsforNon-WovenPara-AramidReinforcement,withAmendment1聚芳基酰胺非织布规范及性能确定方法,包括修改单1
IPC-4411-AM1SpecificationandCharacterizationMethodsforNon-WovenPara-AramidReinforcement,Amendment1关于聚芳基酰胺非织布规范及性能确定方法的修改单1
IPC-SG-141SpecificationforFinishedFabricWovenfrom“S”GlassforPrintedBoards印制板用经处理S玻璃纤维织物规范
IPC-A-142SpecificationforFinishedFabricWovenfromAramidforPrintedBoards印制板用经处理聚芳酰胺纤维编织物规范
IPC-QF-143SpecificationforFinishedFabricWovenfromQuartz(PureFusedSilica)forPrintedBoards印制板用经处理石英（熔融纯氧化硅）纤维编织物规范
IPC-2524PWBFabricationDataQualityRatingSystem印制板制造数据质量定级体系
IPC-9151APrintedBoardProcess,Capability,QualityandRelativeReliabilityBenchmarkTestStandardandDatabase印制板工艺,容量,质量,可靠性试验标准和数据库
IPC-9191GeneralGuidelinesforImplementationofStatisticalProcessControl(SPC)实施统计过程控制(SPC)的通用导则
IPC-9199StatisticalProcessControl(SPC)QualityRating统计分析控制
IPC-9252GuidelinesandRequirementsforElectricalTestingofUnpopulatedPrintedBoards未组装印制板电测试要求和指南
IT-97061PWBHoletoLandMisregistration:CausesandReliability印制线路板通孔与焊盘的错位:原因和可靠性
IT-98103ReliabilityofMisregisteredandLandlessInnerlayerInterconnectsinThickPanels多层板内部无焊盘层互连错位的可靠性
IPC-MS-810GuidelinesforHighVolumeMicrosection大批量显微剖切导则
IPC-QL-653ACertificationofFacilitiesthatInspect/TestPrintedBoards,Components&Materials印制板、元器件及材料检验试验设备的认证
IPC-TR-483DimensionalStabilityTestingofThinLaminates-ReportonPhase1&2InternationalRoundRobinTest薄层压板尺寸稳走性试—-国际联合试验计划I阶段及II阶段报告
IPC-TR-486RoundRobinStudytoCorrelateIST&MicrosectioningEvaluationsforInner-LayerSeparation内层分离的互连应力测试(IST)与显微剖切相关性联合研究
三、电子组装（Assembly）
IPC-T-50FTermsandDefinitionforInterconnectingandPackagingElectronicCircuits电子电路互连与封装的定义和术语
IPC-S-100StandardsandSpecificationsManual标准和详细说明汇编手册
IPC-E-500IPCElectronicDocumentCollection已出版的IPC标准电子文档资料合订本
IPC-TM-650TestMethodsManual试验方法手册
IPC-ESD-20-20AssociationStandardfortheDevelopmentofanESDControlProgram静电释放控制过程(由静电释放协会制定)
IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies电气与电子组装件锡焊要求
IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1J-STD-001辅助手册及指南及修改说明1
IPC-A-610CAcceptabilityofElectronicAssemblies印制板组装件验收条件
IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-KElectronicAssemblyReferenceSet电子组装成套手册，包括：IPC/EIAJ-STD-001C，IPC-HDBK-001，IPC-A-610C。
IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies电缆和引线贴装的要求和验收
IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology倒装芯片及芯片级封装技术的应用
IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation芯片直装技术实施导则
IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications倒装芯片用半导体设计标准
J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准
IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003ChipMountingTechnology芯片贴装技术
J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology球栅阵列(BGA)及其它高密度封装技术的应用
IPC-7095DesignandAssemblyProcessImplementationforBGAs球栅阵列的设计与组装过程的实施
IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBallsBGA球形凸点的标准规范
IT-98000JPLChipScalePackagingGuidelinesJPL发布的CSP导则注：
IT(TheCaliforniaInstituteofTechnology)JPL(TheJetPropulsionLaboratory)
IT-98080JPLBallGridArrayPackagingGuidelinesJPL发布的BGA封装导则
IT-98093ITRIChipCarrier,Phase1ReportITRI关于芯片载体的报告ITRI(TheInterconnectTechnologyResearchInstitute)
IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization多芯片组件技术应用导则
IPC-M-108CleaningGuidesandHandbookManual清洗导则和手册
IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs?电路板离子洁净度测量：它告诉我们什么？
IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies印制板及组装件清洗导则
IPC-SC-60APostSolderSolventCleaningHandbook锡焊后溶剂清洗手册
IPC-SA-61PostSolderSemi-aqueousCleaningHandbook锡焊后半水溶剂清洗手册
IPC-AC-62AAqueousPostSolderCleaningHandbook锡焊后水溶液清洗手册
IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrintedCircuitAssemblies电化学迁移：印制电路组件的电气诱发故障
IPC-TR-580CleaningandCleanlinessTestProgramPhase1TestResults清洗及清洁度试验计划1阶段试验结果
IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3–LowSolids,FluxesandPastesProcessedinAmbientAirIPC第3阶段非清洗助焊剂研究
IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting深入离子洁净度测试
IPC-9201SurfaceInsulationResistanceHandbook表面绝缘电阻手册
IPC-TP-104KCleaning&CleanlinessTestProgram,Phase3WaterSolubleFluxes,Part1&Part2第3阶段水溶性助焊剂清洗，第一和第二部分
IPC-M-109ComponentHandlingManual元件处理手册
IPC/JEDECJ-STD-020BMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices非密封固态表面贴装器件湿度／再流焊敏感度分类
IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
IPC/JEDECJ-STD-035AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponents非气密封装电子元件用声波显微镜
IPC-9500-KSetoffourdocuments9501-95049501至9504手册合订本
IPC-DRM-18FComponentIdentificationDeskReferenceManual零件分类标识手册
IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册
IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册
IPC-DRM-56WirePreparation&CrimpingDeskReferenceManual导线和端子预成形参考手册
IPC-DRM-53IntroductiontoElectronicsAssemblyDeskReferenceManual电子组装基础介绍手册
IPC-M-103StandardsforSurfaceMountAssembliesManual所有SMT标准合订本
IPC-M-104StandardsforPrintedBoardAssemblyManual10种常用印制板组装标准合订本
IPC-TA-722TechnologyAssessmentofSoldering锡焊技术精选手册
IPC-TA-723TechnologyAssessmentHandbookonSurfaceMounting表面安装技术精选手册
IPC-TA-724TechnologyAssessmentSeriesonCleanRooms清洁室技术精选系列
IPC-SM-780ComponentPackagingandInterconnectingwithEmphasisonSurfaceMounting以表面安装为主的元件封装及互连导则
IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountAttachments表面安装焊接件加速可靠性试验导则
IPC-PD-335ElectronicPackagingHandbook电子封装手册
IPC-7525StencilDesignGuidelines网版设计导则
IPC-TR-581IPCPhaseIIIControlledAtmosphereSolderingStudyIPC第3阶段受控气氛焊接研究
IPC-MI-660IncomingInspectionofRawMaterialsManual原材料接收检验手册
IPC/EIAJ-STD-004RequirementsforSolderingFluxes-IncludesAmendment1锡焊焊剂要求（包括修改单1）
IPC/EIAJ-STD-005RequirementsforSolderingPastes-IncludesAmendment1焊膏技术要求（包括修改单1）
IPC-HDBK-005GuidetoSolderPasteAssessment焊膏性能评价手册
IPC/EIAJ-STD-006ARequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSolders电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求
IPC-SM-817GeneralRequirementsforDielectricSurfaceMountingAdhesives表面安装用介电粘接剂通用要求
IPC-CA-821GeneralRequirementsforThermallyConductiveAdhesives导热胶粘剂通用要求
IPC-3406GuidelinesforElectricallyConductiveSurfaceMountAdhesives表面贴装导电胶使用指南
IPC-3408GeneralRequirementsforAnisotropicallyConductiveAdhesivesFilms各向异性导电胶膜的一般要求
IPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies印制板组装电气绝缘性能和质量手册
IPC-HDBK-830GuidelineforDesign,SelectionandApplicationofConformalCoatings敷形涂层的设计，选择和应用手册
IPC-SM-840CQualificationandPerformanceofPermanentSolderMask-IncludesAmendment1永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840GuidetoSolderPasteAssessment焊膏性能评价手册
IPC-TP-1114TheLayman’sGuidetoQualifyingaProcesstoJ-STD-001基于J-STD-001组装工艺雷氏选择法
IPC-TR-467SupportingData&NumericalExamplesforJ-STD-001(ControlofFluxes)J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820Assembly&JoiningHandbook装联手册
IPC-7530GuidelinesforTemperatureProfilingforMassSoldering(Reflow&Wave)Processes大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090TheLayman’sGuidetoQualifyingNewFluxes新型助焊剂雷氏选择法
IPC-TP-1115SelectionandImplementationStrategyforaLow-ResidueNo-CleanProcess低残留不清洗工艺的选择和实施
IPC-S-816SMTProcessGuideline&Checklist表面安装技术过程导则及检核表
IPC-TR-460ATrouble-ShootingChecklistforWaveSolderingPrintedWiringBoards印制板波峰焊故障排除检查表
IPC-CM-770DComponentMountingGuidelinesforPrintedBoards印制板元件安装导则
IPC-7912CalculationofDPMO&ManufacturingIndicesforPrintedBoardAssemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261In-ProcessDPMOandEstimatedYieldforPWAs印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501PWBAssemblyProcessSimulationforEvaluationofElectronicComponents电子元件的印制板组装过程模拟评价
IPC-9502PWBAssemblySolderingProcessGuidelineforElectronicComponents电子元件的印制板组装焊接过导则
IPC-9503MoistureSensitivityClassificationforNon-ICComponents非集成电路元件的湿度敏感度分级
IPC-9504AssemblyProcessSimulationforEvaluationofNon-ICComponents(PreconditioningNon-ICComponents)非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
IPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KIT表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW,IPC-9850-TM-KTestMaterialsKitforSurfaceMountPlacementEquipmentStandardization表面贴装设备性能测试用的标准工具包•
IPC-9850PlacementAccuracyVerificationPanels•1IPC-9850CMMMeasurementVerificationPanels•
IPC-9850QFP-100GlassComponents•130IPC-9850QFP-208GlassComponents•150IPC-9850BGA-228GlassComponents•NISTTraceableMeasurementCertificate•CustomStorageCase
IPC-7711/217711&7721Package合订本
IPC-7711ReworkofElectronicAssemblies电子组装件的返工
IPC-7721RepairandModificationofPrintedBoardsandElectronicAssemblies印制板和电子组装件的修复与修正
IPC/EIAJ-STD-002BSolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIAJ-STD-003SolderabilityTestsforPrintedBoards印制板可焊性试验
IPC-TR-461Trouble-ShootingChecklistforWaveSolderingPrintedWiringBoards印制板波峰焊故障排除检查表
IPC-TR-462SolderabilityEvaluationofPrintedBoardswithProtectiveCoatingsOverLong-termStorage带保护性涂层印制板长期贮存的可焊性评价
IPC-TR-464AcceleratedAgingforSolderabilityEvaluations可焊性加速老化评价(附修订)
IPC-TR-465-1RoundRobinTestonSteamAgerTemperatureControlStability蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2TheEffectofSteamAgingTimeandTemperatureonSolderabilityTestResults蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3EvaluationofSteamAgingonAlternativeFinishes,PhaseIIA替代涂覆层的蒸汽老化评价
IPC-TR-466TechnicalReport:WettingBalanceStandardWeightComparisonTest技术报告:润湿天平称重标准对比测试
SMC-WP-001SolderingCapabilityWhitePaperReport可焊性工艺导论
SMC-WP-005PCBSurfaceFinishes印制电路板表面清洗